Mr. Daniel F. Murphy Profile

Daniel F. Murphy

Program Manager at RTX Corp

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Author

Publications (18)

Proceedings Article | 14 May 2007 Paper

640 × 512 17 µm microbolometer FPA and sensor development

R. Wyles, C. Hewitt, T. Sessler, K. Almada, D. Van Lue, S. Baur, D. Murphy, J. Wyles, M. Ray, E. Gordon, S. Black

Proceedings Volume 6542, 65421Z (2007) https://doi.org/10.1117/12.724345

KEYWORDS: Sensors, Staring arrays, Microbolometers, Readout integrated circuits, Electronics, Thermography, Bolometers, Interfaces, Silicon, Power supplies

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Proceedings Article | 17 May 2006 Paper

High sensitivity 640 × 512 (20 μm pitch) microbolometer FPAs

M. Ray, S. Baur, C. Le Pere, C. Hewitt, E. Gordon, A. Kennedy, R. Chin, D. Murphy, J. Wyles, S. Anderson, D. Van Lue, H. Gonzalez, T. Sessler, S. Ton, R. Wyles

Proceedings Volume 6206, 62061A (2006) https://doi.org/10.1117/12.674018

KEYWORDS: Staring arrays, Sensors, Microbolometers, Electronics, Readout integrated circuits, Cameras, Nonuniformity corrections, Thermography, Resistance, Infrared imaging

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RVS has made a significant breakthrough in the development of a 640 × 512 array with a unit cell size of 20μm × 20 μm and performance equivalent to that of the 25μm arrays. The successful development of this array is the first step in achieving mega-pixel formats. This FPA is designed to ultimately achieve performance near the temperature fluctuation limited NETD (<20mK, f/1, 30 Hz). The SB-300 is a highly productized readout and is designed to achieve very good sensitivity (low NETD and low spatial noise) and good dynamic range. The improved performance is through bolometer structure improvements and an innovative ROIC design. It also has a simple and flexible electrical interface which allows external electronics to be small, light, low-cost, and low-power. Almost all adjustments can be made through the serial interface; hence there is no need for external adjustable (DAC) circuitry. The improved power supply rejection helps maintain highly stable detector and strip resistor bias voltages which helps reduce spatial noise and image artifacts. We will show updated performance and imagery on these arrays, which is currently being measured at <30mK, f/1,555 30 Hz. Pixel operability is greater than 99.5% on most FPAs, where the uncorrected responsivity nonuniformity is less than 4% (sigma/mean), and time constant for these arrays was measured at <8msec. We will report detailed FPA performance results including responsivity, noise, uniformity and pixel operability. We also plan to present video imagery from the most recent FPAs. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 20 μm pixel will allow an optical volume that is 50 % the size of a 25 μm based system! We will also provide an update on the enhanced performance and yield producibility of our NVESD ManTech 640 × 480 25 μm arrays, and also show data on 25 μm arrays that have been designed for faster time constants (5 ms), while maintaining high performance. We will also show the improvement in our uncooled 320 × 240 and 640 × 480 sensor electronics in terms of reduced power and size for helmet and rifle mounted sensors.

Proceedings Article | 31 May 2005 Paper

Expanded applications for high performance VOx microbolometer FPAs

C. Hewitt, T. Sessler, A. Kennedy, H. Gonzalez, R. Chin, S. Baur, D. Murphy, S. Ton, M. Ray, T. Kostrzewa, R. Wyles, C. Le Pere, J. Wyles, S. Anderson, E. Gordon, D. Van Lue

Proceedings Volume 5783, (2005) https://doi.org/10.1117/12.609462

KEYWORDS: Microbolometers, Staring arrays, Sensors, Readout integrated circuits, Thermography, Infrared imaging, Bolometers, Mid-IR, Resistance, Electronics

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Proceedings Article | 30 August 2004 Paper

Performance improvements for VOx microbolometer FPAs

Adam Kennedy, S. Ton, David Van Lue, Steven Anderson, Richard Wyles, Thomas Kostrzewa, Stefan Baur, Richard Chin, C. Le Pere, James Asbrock, T. Sessler, C. Hewitt, Michael Ray, H. Gonzales, Daniel Murphy, Jessica Wyles, Eli Gordon

Proceedings Volume 5406, (2004) https://doi.org/10.1117/12.548883

KEYWORDS: Microbolometers, Staring arrays, Sensors, Readout integrated circuits, Imaging systems, Electronics, Infrared imaging, Thermography, Resistance, Semiconducting wafers

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Proceedings Article | 10 October 2003 Paper

Resolution and sensitivity improvements for VOx microbolometer FPAs

Adam Kennedy, David Van Lue, John Anderson, C. Le Pere, James Asbrock, H. Gonzales, Richard Chin, C. Hewitt, Daryl Bradley, Richard Wyles, Daniel Murphy, T. Sessler, Jessica Wyles, Thomas Kostrzewa, Michael Ray

Proceedings Volume 5074, (2003) https://doi.org/10.1117/12.487657

KEYWORDS: Microbolometers, Sensors, Staring arrays, Readout integrated circuits, Resistance, Thermography, Imaging systems, Electronics, Cameras, Unmanned aerial vehicles

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Raytheon Vision Systems (RVS) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon is producing high-quality 320 x 240 microbolometer FPAs with 25 μm pitch pixels. The 320 x 240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 μm pixels. The array average NETD value for these FPAs is about 30 mK with an f/1 aperture and operating at 30 Hz frame rates. Pixel operability is greater than 99% on most FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). These 25 μm microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micro machining fabrication process, which allows maximization of both the thermal isolation and the optical fill-factor. These arrays have produced excellent image quality, and are currently fielded in demonstration systems. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 25 μm pxiels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. These FPAs are applicable to wide-field-of-view, long-range surveillance and targeting missions. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased, and also has enabled the development of a large-format 640 x 480 FPA array. Raytheon is producing these arrays with very good sensitivity. These arrays have excellent operability and image quality. Several dual FOV prototype systems have been delivered under the LCMS and UAV programs, and are under evaluation at NVESD. Raytheon Vision Systems (RVS) has developed a flexible uncooled front end (UFE) electronics that will serve as the basis for camera engine systems using 320 x 240 and 640 x 480 FPAs. The focus has been to develop architecture suitable for a wide variety of systems from low cost modest performance to high performance military applications. This product has been designed with military environmental and shock and vibration conditions in mind. Intended for small pxiel, high performance applications, the UFE is the ideal cornerstone for ground and airborne UAV, multi-mode sneosr, weapon sight or seeker architectures.

Proceedings Article | 10 October 2003 Paper

Advances in uncooled systems applications

Chungte Chen, C. Le Pere, John Anderson, Daniel Murphy, Richard Chin, K. Kostrzewa, S. Ton, James Miller, H. Gonzalez, Ronald Hegg, Michael Ray, Gwendolyn Newsome, Adam Kennedy, Richard Wyles, Daryl Bradley

Proceedings Volume 5074, (2003) https://doi.org/10.1117/12.487646

KEYWORDS: Sensors, Staring arrays, Thermography, Infrared sensors, Cameras, Infrared imaging, Microbolometers, Readout integrated circuits, Surveillance, Unmanned aerial vehicles

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Proceedings Article | 23 January 2003 Paper

High-sensitivity 25-um microbolometer FPAs

Daryl Bradley, John Anderson, Richard Chin, Thomas Kostrzewa, Michael Ray, Daniel Murphy, David Van Lue, Adam Kennedy, Jessica Wyles, Nancy Lum, Richard Wyles, James Asbrock, C. Hewitt

Proceedings Volume 4820, (2003) https://doi.org/10.1117/12.453902

KEYWORDS: Staring arrays, Microbolometers, Sensors, Resistance, Thermography, Semiconducting wafers, Micromachining, Image quality, Image resolution, Analog electronics

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Proceedings Article | 5 August 2002 Paper

High-sensitivity 25-micron microbolometer FPAs

Daryl Bradley, Richard Wyles, Jessica Wyles, John Anderson, Adam Kennedy, Richard Chin, David Van Lue, Michael Ray, James Asbrock, Thomas Kostrzewa, Nancy Lum, C. Hewitt, Daniel Murphy

Proceedings Volume 4721, (2002) https://doi.org/10.1117/12.478857

KEYWORDS: Staring arrays, Microbolometers, Sensors, Thermography, Resistance, Readout integrated circuits, Image quality, Micromachining, Semiconducting wafers, Infrared radiation

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Proceedings Article | 29 July 2002 Paper

Low-cost microsensors program

John Anderson, Ronald Hegg, Daniel Murphy, James Brown, Adam Kennedy, Richard Chin, Daryl Bradley, Richard Wyles, Chungte Chen, Gwendolyn Newsome, Michael Ray

Proceedings Volume 4719, (2002) https://doi.org/10.1117/12.477439

KEYWORDS: Sensors, Staring arrays, Infrared sensors, Microsensors, Thermography, Microbolometers, Readout integrated circuits, Infrared imaging, Surveillance, Cameras

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Proceedings Article | 12 November 2001 Paper

High-sensitivity (25-um pitch) microbolometer FPAs

Thomas Kostrzewa, Nancy Lum, Tad Horikiri, Richard Wyles, Adam Kennedy, John Anderson, James Asbrock, Richard Chin, Jessica Wyles, Glen Graham, C. Hewitt, Daniel Murphy, Daryl Bradley, Michael Ray

Proceedings Volume 4454, (2001) https://doi.org/10.1117/12.448169

KEYWORDS: Staring arrays, Microbolometers, Sensors, Readout integrated circuits, Resistance, Thermography, Bolometers, Interfaces, Semiconducting wafers, Micromachining

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Proceedings Article | 10 October 2001 Paper

Low-cost microsensors program

Daryl Bradley, Richard Chin, James Brown, Adam Kennedy, John Anderson, Chungte Chen, Richard Wyles, Daniel Murphy, William Radford, Gwendolyn Newsome, K. Jurgelewicz, Michael Ray

Proceedings Volume 4369, (2001) https://doi.org/10.1117/12.445315

KEYWORDS: Sensors, Staring arrays, Microsensors, Infrared sensors, Readout integrated circuits, Surveillance, Microbolometers, Thermography, Cameras, Packaging

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Proceedings Article | 10 October 2001 Paper

High-sensitivity (25-um pitch) microbolometer FPAs and application development

Adam Kennedy, Glen Graham, C. Hewitt, Daniel Murphy, Richard Wyles, James Asbrock, Daryl Bradley, Richard Chin, Nancy Lum, John Anderson, Jessica Wyles, Michael Ray, Thomas Kostrzewa, William Radford

Proceedings Volume 4369, (2001) https://doi.org/10.1117/12.445290

KEYWORDS: Staring arrays, Microbolometers, Sensors, Cameras, Resistance, Thermography, Surveillance, Electronics, Semiconducting wafers, Readout integrated circuits

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Proceedings Article | 10 October 2001 Paper

Integrated imaging sensors

A. Reinheimer, Dieter Lohrmann, Lacy Cook, Michael Ray, A. Finch, J. Janesick, William Radford, T. Dosluoglu, G. Baker, Thomas Kostrzewa, John Anderson, Adam Kennedy, Michael Jack, J. Kojiro, Daniel Murphy, Richard Wyles, G. Williams

Proceedings Volume 4369, (2001) https://doi.org/10.1117/12.496294

KEYWORDS: Charge-coupled devices, Image fusion, Firearms, Visible radiation, Infrared imaging, Imaging systems, Sensors, Silicon, Staring arrays, Optical sensors

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Proceedings Article | 21 July 2000 Paper

Low-Cost Microsensors Program

Gwendolyn Newsome, John Anderson, William Radford, Daniel Murphy, James Brown, Daryl Bradley, Michael Ray, Richard Chin, Adam Kennedy, Richard Wyles

Proceedings Volume 4040, (2000) https://doi.org/10.1117/12.392562

KEYWORDS: Sensors, Microsensors, Staring arrays, Cameras, Surveillance, Infrared sensors, Packaging, Thermography, Vanadium, Oxides

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Proceedings Article | 26 July 1999 Paper

Sensitivity improvements in uncooled microbolometer FPAs

Daniel Murphy, Kathy Hay, James Finch, John Varesi, Aladin Sayed, Edgar Moody, Adam Kennedy, Michael Ray, Jessica Wyles, William Radford, F. Cheung, Richard Wyles

Proceedings Volume 3698, (1999) https://doi.org/10.1117/12.354511

KEYWORDS: Sensors, Staring arrays, Microbolometers, Cameras, Resistance, Etching, Readout integrated circuits, Digital signal processing, Radiometry, Thermography

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Proceedings Article | 26 October 1998 Paper

Microbolometer uncooled infrared camera with 20-mK NETD

A. Finch, Richard Wyles, F. Cheung, Michael Ray, Adam Kennedy, William Radford, John Varesi, Jessica Wyles, Stefan Baur, Daniel Murphy, Edgar Moody, R. Coda

Proceedings Volume 3436, (1998) https://doi.org/10.1117/12.328064

KEYWORDS: Microbolometers, Staring arrays, Sensors, Cameras, Readout integrated circuits, Etching, Digital signal processing, Infrared imaging, Infrared sensors, Resistance

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Proceedings Article | 22 July 1998 Paper

Microbolometer uncooled infrared camera with 20-mK NETD

William Radford, A. Finch, J. Kojiro, Edgar Moody, Adam Kennedy, Michael Ray, Daniel Murphy, R. Coda, Stefan Baur, Richard Wyles

Proceedings Volume 3379, (1998) https://doi.org/10.1117/12.317595

KEYWORDS: Microbolometers, Staring arrays, Sensors, Cameras, Readout integrated circuits, Etching, Digital signal processing, Resistance, Infrared sensors, Silicon

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Proceedings Article | 17 June 1996 Paper

320x240 silicon microbolometer uncooled IR FPAs with on-chip offset correction

Steven Propst, R. Coda, Stefan Baur, James Woolaway, William Radford, Edgar Moody, Daniel Murphy, J. Kojiro, Adam Kennedy, Michael Ray, G. Lung, Kevin Soch, D. Gleichman

Proceedings Volume 2746, (1996) https://doi.org/10.1117/12.243062

KEYWORDS: Staring arrays, Microbolometers, Sensors, Silicon, Semiconducting wafers, Infrared imaging, Bolometers, Infrared radiation, Thermography, Infrared cameras

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Showing 5 of 18 publications

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