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Patricia Tan
at Jet Propulsion Lab
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Author
Publications (2)
Proceedings Article | 23 August 2024 Poster + Paper
The Ariel payload electrical and electronic architecture: a summary of the current design and implementation status
M. Focardi, V. Noce, P. Merola, A. Di Giorgio, S. Ligori, L. Corcione, V. Capobianco, D. Bonino, M. V. Nunez, S. Chiarucci, E. Medinaceli, N. Auricchio, M. Farina, G. Giusi, A. Russi, A. Tortora, L. Serafini, A. Pannocchia, G. Giglio, M. Passerai, M. Verna, C. Del Vecchio Blanco, G. Morgante, J. Ateca, J. Bosch, M. Carmona, A. Casas, J. Gomez, P. Lopez, L. Marti, A. Royo, O. Ruiz, C. Serre, K. Skup, K. Rutkowski, M. Sobiecki, K. Ber, M. Sobolewski, N. Thernstrom, M. Winklera, M. Ciarka, M. Berthé, C. Cara, J. Fontignie, J. Martignac, G. Kaszubiak, N. Leguay, R. Grimoldi, G. Ober, R. Goullioud, W. Holmes, M. Swain, G. Vasisht, H. Cho, J. Mulder, G. Allen, A. Runkle, E. Guzman, M. Weilert, C. Weber, P. Tan, J. Morales, J. Hunacek, A. Rieck, A. Bolduc, K. Aaron, A. Turner, B. Krohn, M. Lew, A. Cillis, R. Foltz, T. Hewagama, M. Loose, M. Crook, M. Hills, G. Gilley, S. Mäkinen, A. Caldwell, G. Bishop, L. Desjonqueres, R. Drummond, P. Eccleston, A. Davidson, P. Umesh, E. Pace, G. Preti, G. Micela, G. Malaguti, G. Tinetti
Proceedings Volume 13092, 1309249 (2024) https://doi.org/10.1117/12.3018741
KEYWORDS: Sensors, Equipment, Field programmable gate arrays, Interfaces, Multiplexers, Design, Control systems, Spectroscopy, Space operations, Telescopes
Proceedings Article | 29 August 2022 Presentation + Paper
Packaging design and test of cryogenic readout electronics for the Euclid Near Infrared Spectrophotometer
W. Holmes, H. Aghakians, S. Avasapian, A. Bahraman, A. Berg, A. Beyer, E. Boehmer, R. Calvet, S. Cheung, B. Cho, H. Cho, A. Cillis, L. DelCastillo, M. Dickie, G. Delo, M. Farris, A. Feizi, N. Ferraro, L. Fischer, R. Foltz, N. Hambarsoumian, K. Hong, T. Huang, M. Jhabvala, Er. Kan, R. Kopp, B. Krohn, D. Lewis, M. Loose, K. MacNeal, J. Maiten, D. Markley, G. Maldonado, J. Mehta, J. Melendez, A. Morgan, J. Mulder, M. Ngyuen, N. Ovee, M. Pniel, S. Pravdo, D. Randall, J. Riendeau, A. Runkle, M. Runyan, M. Seiffert, M. Skalare, P. Tan, A. Turner, S. Van Nostrand, A. Waczynski, J. Wu
Proceedings Volume 12191, 121911U (2022) https://doi.org/10.1117/12.2629611
KEYWORDS: Cryogenics, Electronics, Reliability, Aluminum, Silicon, Interfaces, Packaging, Analog electronics, Temperature metrology, Gold
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