For a multi mode fiber optical link, a high speed silicon photonics receiver based on a highly alignment tolerant
vertically illuminated germanium photodiode was developed. The germanium photodiode has 20 GHz bandwidth and
responsivity of 0.5 A/W with highly alignment tolerance for passive optical assembly. The receiver achieves 25 Gbps
error free operation after 100 m multi mode fiber transmission.
Germanium light-emitting devices on silicon for very-short-reach interconnect were investigated theoretically and experimentally. Our approach to enhance light emission is by applying process-induced strain to the germanium active layer. According to first-principles calculations, larger optical gain in germanium with lower carrier density is obtained at a larger tensile strain. In addition to the thermally induced strain caused by the difference of the thermal expansion ratios, process-induced stress was applied to the germanium active layer by fabricating a SiN stressor on it. As for practical light-emitting devices, a laterally injected light-emitting device was fabricated and tested. In the case of this device, the current is laterally injected into the germanium active layer through a thin silicon layer. In this device structure, mode loss caused by free carrier absorption is expected to be small, since the guided mode overlaps slightly with the heavily doped silicon layer. The electroluminescence (EL) property of the device showed a superlinear increase in integrated EL intensity with increasing injection current, indicating that direct recombination is enhanced by L-valley filling. An increase in intensity and red-shift of the EL peaks of the device with a SiN stressor indicate that additional tensile strain was successfully applied to the germanium active layer.
Wire-length dependences of In-place polarization anisotropy in GaInAsP/InP quantum-wire (Q-wire) structures
fabricated by dry-etching and regrowth processes were investigated using a photo luminescence (PL) measurement. The
reduction of polarization anisotropy of Q-wires is expected in the shorter Q-Wires. A strain-compensated GaInAsP/InP
single-quantum-well initial wafer was prepared by an organometallic-vapor-phase-epitaxy (OMVPE) system. Using
electron beam lithography, Ti-mask lift-off, CH4/H2 reactive-ion-etching and OMVPE regrowth processes, various
lengths (L) of the Q-wires were realized for wire-widths (W) of 11-, 14- and 18 nm. The Q-wires were measured the
polarization property in normal and parallel to wire-length direction at room temperature. As a result, stronger
polarization anisotropy was observed in narrower Q-Wires and reduced in shorter length of Q-Wires. Furthermore,
polarization anisotropy of strained Q-Wires was predicted by taking in account of the dipole moment interaction between
conduction and heavy-hole subbands optical transition. A 5-nm narrowed wire-width calculation results shows a good
agreement with experimental results. This could be considered that a strain distribution in the Q-Wire induced the energy
band deformation at the edge of the Q-Wire, which reduced the effective wire-width to much narrower than the actual
size observed by an SEM image.
In order to realize low damage fine structuring processes for the low-dimensional quantum structures, we investigated a
process for reducing the degradations of optical properties, which was induced during a reactive-ion-etching (RIE)
process with CH4/H2 gas mixture in the quantum-well (QW) structures. Quantitative studies of optical degradation were
carried out by photoluminescence (PL) and electroluminescence (EL) measurements. We introduced a thicker upper
optical confinement layer (OCL) to protect the QWs from the RIE-plasma. In practical, for the PL measurement, twotypes
of strain-compensated single-quantum-well (SC-SQW) structures were prepared for 40-nm-thick- and 80-nmthick-
upper OCL wafers and covered by 20-nm-thick SiO2. After the samples were exposed to CH4/H2-RIE for 5-
minutes, a relatively stronger suppression of integral PL intensity as well as a spectral broadening was observed in the
sample with 40-nm-thick OCL, while those did not change in the sample with 80-nm-thick OCL. For the EL
measurements, using two types of SC-DQW structures, samples were exposed to CH4/H2-RIE plasma for 5-minute and
then re-grown for other layers to form high-mesa stripe laser structures (Ws=1.5μm). As a result, the spontaneous
emission efficiency of the lasers with 80-nm-thick OCL was almost 2 times higher than that of the lasers with 40-nmthick
OCL. In addition, a lower threshold current as well as a higher differential quantum efficiency was obtained for the
lasers with 80-nm-thick OCL , while that in lasers with 40-nm-thick OCL indicated poor efficiency and a slightly higher
threshold.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.