Dr. Yoichi Murakoshi Profile

Dr. Yoichi Murakoshi

Senior Research Fellow at AIST

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Author

Publications (8)

Proceedings Article | 23 February 2005 Paper

Development of a MEMS-based micro combustor for a micro gas turbine engine

Xue Chuan Shan, Yu Jin, Zhen Wang, Chee Khuen Wong, Y. Murakoshi, Ryutaro Maeda

Proceedings Volume 5650, (2005) https://doi.org/10.1117/12.580783

KEYWORDS: Semiconducting wafers, Deep reactive ion etching, Combustion, Etching, Temperature metrology, Silicon, Hydrogen, Prototyping, Photoresist materials, Optical lithography

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Proceedings Article | 2 April 2004 Paper

Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet

Yoichi Murakoshi, Xue-Chuan Shan, Toshio Sano, Masaharu Takahashi, Ryutaro Maeda

Proceedings Volume 5276, (2004) https://doi.org/10.1117/12.522898

KEYWORDS: Mirrors, Nickel, Optical switching, Microelectromechanical systems, Polymers, Optical design, Scanning electron microscopy, Nanoelectromechanical systems, Optical semiconductors, Semiconductors

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Proceedings Article | 2 April 2004 Paper

High-aspect-ratio fabrications of micro journal air bearings for micro gas turbine engine

Xue Shan, Yoichi Murakoshi, Zhenfeng Wang, H. Lu, Yufeng Jin, Tsuyoshi Ikehara, Ryutaro Maeda, C. Wong

Proceedings Volume 5276, (2004) https://doi.org/10.1117/12.522918

KEYWORDS: Semiconducting wafers, Etching, Deep reactive ion etching, Plasma, Silicon, Photoresist materials, Photomasks, Ions, Surface roughness, Process control

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Proceedings Article | 13 November 2002 Paper

Development of a micro hot embossing process for fabricating micro optical devices

Xue Shan, Ryutaro Maeda, Yoichi Murakoshi

Proceedings Volume 4936, (2002) https://doi.org/10.1117/12.469430

KEYWORDS: Mirrors, Optical switching, Switches, Polymers, Annealing, Micromirrors, Nickel, Silicon, Optical components, Microelectromechanical systems

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Proceedings Article | 21 November 2001 Paper

Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and vacuum metal casting

Yoichi Murakoshi, Kotaro Hanada, Yaomin Li, Kazuyoshi Uchino, Takaaki Suzuki, Ryutaro Maeda

Proceedings Volume 4592, (2001) https://doi.org/10.1117/12.449004

KEYWORDS: Metals, Semiconducting wafers, Silicon, Etching, Wafer bonding, Microelectromechanical systems, Photomasks, Image processing, Packaging, Scanning electron microscopy

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Proceedings Article | 5 April 2001 Paper

Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection

Yoichi Murakoshi, Toru Shimizu, Hideki Takagi, Yaomin Li, Kazuyoshi Uchino, Tetsuro Yokoi, Ryutaro Maeda

Proceedings Volume 4408, (2001) https://doi.org/10.1117/12.425391

KEYWORDS: Metals, Semiconducting wafers, Silicon, Etching, Wafer bonding, Photomasks, Microelectromechanical systems, Image processing, Packaging, Scanning electron microscopy

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Proceedings Article | 21 March 2001 Paper

Si-based print circuit board fabricated by Si deep etching and metal powder injection molding

Ryutaro Maeda, Yoichi Murakoshi, Toru Shimizu, Yaomin Li, Hiroyuki Takizawa

Proceedings Volume 4235, (2001) https://doi.org/10.1117/12.420860

KEYWORDS: Silicon, Etching, Metals, Smart structures

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Proceedings Article | 10 March 1999 Paper

Microfabrication technique for thick structure of metals and PZT

Toru Shimizu, Yoichi Murakoshi, Zhanjie Wang, Ryutaro Maeda, Toshio Sano

Proceedings Volume 3680, (1999) https://doi.org/10.1117/12.341236

KEYWORDS: Ferroelectric materials, Coating, Metals, Photography, Thin film coatings, Silicon, Semiconducting wafers, Ceramics, Laser ablation, Microfabrication

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Showing 5 of 8 publications

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