Dr. Christian J. Kulik Profile

Dr. Christian J. Kulik

at Laser Zentrum Hannover eV

SPIE Involvement:

Author

Publications (17)

Proceedings Article | 8 October 2004 Paper

Short and ultrashort laser pulses: application-driven comparison of source types

Christian Kulik, Andreas Ostendorf

Proceedings Volume 5662, (2004) https://doi.org/10.1117/12.596594

KEYWORDS: Laser ablation, Laser cutting, Manufacturing, Pulsed laser operation, Laser applications, Absorption, Laser processing, Electrons, Polymers, Semiconductors

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Proceedings Article | 8 October 2004 Paper

The influence of physical characteristics on ablation effects in UV laser assisted micro engineering

Andreas Ostendorf, Christian Kulik, Thorsten Temme, Frank Otte, Katja Samm

Proceedings Volume 5662, (2004) https://doi.org/10.1117/12.596754

KEYWORDS: Laser ablation, Metals, Copper, Molybdenum, Tantalum, Pulsed laser operation, Nickel, Iron, Thermography, Tungsten

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Proceedings Article | 15 July 2004 Paper

Short and ultrashort laser pulses: an upcoming tool for processing optical and semiconductor materials

Christian Kulik

Proceedings Volume 5339, (2004) https://doi.org/10.1117/12.541437

KEYWORDS: Laser ablation, Silicon, Laser processing, Laser cutting, Absorption, Semiconductor lasers, Pulsed laser operation, Manufacturing, Dielectrics, Electrons

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Proceedings Article | 15 July 2004 Paper

Basic investigations for controlling the laser spot welding process when packaging 3-dimensional molded interconnect devices

Andreas Ostendorf, Christian Kulik, Matthias Stallmach, Jeihad Zeadan

Proceedings Volume 5339, (2004) https://doi.org/10.1117/12.530515

KEYWORDS: Signal processing, Sensors, Laser welding, Lead, Optical filters, Packaging, Spectroscopy, Signal detection, Laser processing, Scanning electron microscopy

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Proceedings Article | 1 June 2004 Paper

Ablation of metals and semiconductors with ultrashort pulsed lasers: improving surface qualities of microcuts and grooves

Andreas Ostendorf, Christian Kulik, Thorsten Bauer, Niko Baersch

Proceedings Volume 5340, (2004) https://doi.org/10.1117/12.530692

KEYWORDS: Laser cutting, Laser ablation, Femtosecond phenomena, Silicon, Electrons, Semiconductor lasers, Metals, Semiconducting wafers, Laser systems engineering, Pulsed laser operation

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Proceedings Article | 2 April 2004 Paper

Precision shaping of transparent materials for optical devices with VUV laser radiation

Thorsten Temme, Andreas Ostendorf, Christian Kulik

Proceedings Volume 5399, (2004) https://doi.org/10.1117/12.552744

KEYWORDS: Optical components, Laser ablation, Silica, Nitrogen, Diffractive optical elements, Diffraction gratings, Excimer lasers, Pulsed laser operation, Vacuum ultraviolet, Lenses

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Proceedings Article | 26 February 2004 Paper

Automatic control of a thermal-based polishing process for aspherical optics

Andreas Ostendorf, Christian Kulik, Peer-Olrik Wiechell

Proceedings Volume 5252, (2004) https://doi.org/10.1117/12.513316

KEYWORDS: Surface finishing, Polishing, Glasses, Microwave radiation, Temperature metrology, Laser processing, Process control, Control systems, Automatic control, Pyrometry

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Proceedings Article | 18 November 2003 Paper

Sapphire tools for laser-assisted microforming

Jens Wulfsberg, Sven-Eric Hilpert, Andreas Ostendorf, Christian Kulik, Thorsten Temme, Katja Samm

Proceedings Volume 5063, (2003) https://doi.org/10.1117/12.541442

KEYWORDS: Sapphire, Metals, Excimer lasers, Helium, Aluminum, Sapphire lasers, Manufacturing, Ultraviolet radiation, Laser processing, Transmittance

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Proceedings Article | 18 November 2003 Paper

Machining of optical microstructures with 157 nm laser radiation

Thorsten Temme, Andreas Ostendorf, Christian Kulik

Proceedings Volume 5063, (2003) https://doi.org/10.1117/12.540527

KEYWORDS: Laser ablation, Silica, Nitrogen, Diffraction gratings, Optical components, Atmospheric optics, Diffractive optical elements, Excimer lasers, Lenses, Pulsed laser operation

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Proceedings Article | 17 October 2003 Paper

Precision drilling of fused silica with 157-nm excimer laser radiation

Thorsten Temme, Andreas Ostendorf, Christian Kulik, Klaus Meyer

Proceedings Volume 4977, (2003) https://doi.org/10.1117/12.479557

KEYWORDS: Laser drilling, Silica, Excimer lasers, Plasma, Gas lasers, Laser ablation, Absorption, Glasses, Quartz, Carbon monoxide

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Proceedings Article | 17 October 2003 Paper

Laser-based manufacturing of high-accuracy electrodes into brittle materials

Christian Kulik, Andreas Ostendorf, Frank Meyer

Proceedings Volume 4977, (2003) https://doi.org/10.1117/12.479535

KEYWORDS: Sensors, Electrodes, Manufacturing, Dielectrics, Excimer lasers, Laser ablation, Laser manufacturing, Ceramics, Glasses, Electroplating

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Proceedings Article | 19 February 2003 Paper

Microprocessing using UV solid state laser systems with high repetition rate

Andreas Ostendorf, Klaus Koerber, Christian Kulik, Frank Otte

Proceedings Volume 4830, (2003) https://doi.org/10.1117/12.486508

KEYWORDS: Laser ablation, Silicon, Laser processing, Diode pumped solid state lasers, Semiconductor lasers, Gold, Quartz, Laser cutting, Solid state lasers, Manufacturing

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Proceedings Article | 18 June 2002 Paper

Production of innovative geometries with UV lasers

Andreas Ostendorf, Christian Kulik, Uwe Stute

Proceedings Volume 4637, (2002) https://doi.org/10.1117/12.470634

KEYWORDS: Laser ablation, Excimer lasers, 3D acquisition, Ceramics, Glasses, Ultraviolet radiation, Surface finishing, Sensors, Polishing, Distortion

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Proceedings Article | 18 June 2002 Paper

Laser microwelding of electronic components

Hans Toenshoff, Klaus Koerber, Christian Kulik, K. Schafer

Proceedings Volume 4637, (2002) https://doi.org/10.1117/12.470661

KEYWORDS: Laser welding, Signal processing, Copper, Lead, Laser processing, Electronic components, Process control, Pulsed laser operation, Resistance, Absorption

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Proceedings Article | 1 September 2000 Paper

3D microstructuring with F2 lasers

Hans Toenshoff, Ferdinand von Alvensleben, Andreas Ostendorf, Klaus Koerber, Christian Kulik

Proceedings Volume 4075, (2000) https://doi.org/10.1117/12.397929

KEYWORDS: Laser ablation, Manufacturing, 3D modeling, Laser processing, Glasses, Modeling, Quartz, Excimer lasers, Materials processing, Process modeling

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Proceedings Article | 10 March 1999 Paper

Advanced 3D-CAD interface for micromachining with excimer lasers

Hans Toenshoff, Ferdinand von Alvensleben, Christian Kulik

Proceedings Volume 3680, (1999) https://doi.org/10.1117/12.341218

KEYWORDS: Laser ablation, Excimer lasers, Manufacturing, Modeling, Sensors, Microelectromechanical systems, Microopto electromechanical systems, Glasses, Beam shaping, Interfaces

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Proceedings Article | 5 October 1998 Paper

Comparison of 3D surfaces produced by 248-nm and 193-nm excimer laser radiation

Hans Toenshoff, Christoph Graumann, Marcus Rinke, Hanno Hesener, Christian Kulik

Proceedings Volume 3519, (1998) https://doi.org/10.1117/12.325742

KEYWORDS: Excimer lasers, Glasses, Pulsed laser operation, Laser ablation, Laser processing, Computer aided design, Manufacturing, Absorption, Optical components, Micromachining

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Currently there is a strong demand for refractive optical elements made from glass in 21/2D and 3D-structures. Due to the characteristics of brittle materials like glass, only a limited number of manufacturing methods can be used to machine these materials with sub-micron resolution. Thus, current microstructures made out of glass are mainly manufactured by photolithography and etching process. Lithography techniques are only for economic purposes for a series production, but is not suitable for manufacturing prototypes or a small series. Micromachining done with Excimer Lasers in combination with high precision CNC- controlled handling systems offers flexible design possibilities for optical components. Due to the limitations of conventional machining techniques for brittle materials, a new laser machining system for material processing at a wavelength of 193 nm has been designed and built. The better absorption of 193 nm compared to 248 nm or larger wavelengths leads to damage free microstructuring of most glasses. Data generation for the volume to be ablated starts with the mathematical description of the surface shape of the optical component. The contour can be derived from a mathematical function or individual xyz-data point information from any CAD-program. A pre-processor calculates the CNC-data for laser triggering, xyz-table and the CNC- mask control. Each laser pulse leads to a material removal, defined by the illuminated surface on the workpiece as well as the energy density. Superposition or overlapping of pulses allows the creation of the desired surface. The surface roughness is determined by the wavelength as well as the chosen ablation strategy. To achieve best results, the process has to be carefully adjusted for a specific material. This technique is a sufficient method for structuring grooves in ceramics or glass as well as producing aspherical transparent optical surfaces or micro lens arrays. This paper shall describe the potential of 193 nm treatment of 3D micro surfaces with an optimized process machine and data handling system in comparison with results originating from 248 nm laser processing.

Showing 5 of 17 publications

Conference Committee Involvement (1)

Laser Applications in Microelectronic and Optoelectronic Manufacturing X

24 January 2005 | San Jose, California, United States

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